Ultrasonic energy for adhesive bonding

ABSTRACT

An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding.

CLAIM OF BENEFIT OF FILING DATE

The present application claims the benefit of the filing date of U.S.Provisional Application Ser. No. 60/886,786, filed Jan. 26, 2007, herebyincorporated by reference.

TECHNICAL FIELD

The present invention relates to the use of ultrasonic energy forassisting in adhesive bonding. More particularly, the present inventionrelates to the application of ultrasonic vibration to a member forassisting in bonding an adhesive to one or more surfaces.

BACKGROUND OF THE INVENTION

Adhesive bonding is employed in numerous applications. For example,surfaces of members of articles of manufacture such as automotivevehicles (e.g., cars, busses etc.) and aerospace vehicles (e.g.,airplanes) are often adhesively bonded together in the assembly andmanufacture of those vehicles. Moreover, surfaces of various differentmaterials such as metal, glass, polymeric materials or the like areadhesively bonded to each other in the assembly and manufacture ofvehicles such as those just mentioned or in the assembly and manufactureof various other articles. Examples of adhesive bonding are disclosed inU.S. Pat. Nos. 7,128,373; 6,997,515; 6,984,287; 6,739,673; 6,739,302;6,688,700; 6,543,404; 6,491,346, all of which are incorporated herein byreference for all purposes.

While adhesive bonding has been employed for many years, currenttechniques of adhesive bonding still present many drawbacks. As oneexample, curing times for many adhesive may be undesirably slow. Asanother example, the desired timing for curing of an adhesive during theassembly or manufacture of an article of manufacture may not coincidewith the desired timing for application of the adhesive. As yet anotherexample, the ability of an adhesive to securely bond to a surface can belimited. As still another example, conventional sources of heat and orenergy needed for curing adhesives can be undesirable and/orinconvenient in a variety of manufacturing environments.

Accordingly, there is a need in the industry for methods and techniques,which overcome one or more of the aforementioned drawbacks of adhesivebonding or other drawbacks as will become apparent for the descriptionof the invention.

SUMMARY OF THE INVENTION

There is disclosed a method of bonding an adhesive to a surface of anarticle of manufacture during formation of the article. According to themethod the adhesive is contacted with, during the formation of thearticle of manufacture, a surface of a first substrate. The adhesive isa latent adhesive that is curable by exposure to heat. The adhesiveincludes at least one of an epoxy a, a polyurethane, a polyurea, apolyester, a vinyl ester or a phenolic. The article of manufacture canbe selected from furniture, a transportation vehicle, a householdappliance, a toy or an electronic device. For bonding the adhesive tothe surface of the first substrate, ultrasonic energy is applied to theadhesive. Typically, such energy is applied without the use of addedheat to an environment surrounding the adhesive.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary ultrasonic energy provider according toan aspect of the present invention.

FIG. 2 is a side view of an exemplary adhesion technique according to anaspect of the present invention.

FIGS. 3A and 3B illustrate an adhesive applied to a surface according toan exemplary aspect of the present invention.

FIG. 4 is a perspective view of a vehicle having components adheredaccording to an exemplary aspect of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention is predicated upon the use of ultrasonic energy(e.g., ultrasonic vibration) for assisting in bonding an adhesive to atleast one surface of a member or structure. Accordingly, there isprovided a method that includes a combination of two or more of thefollowing steps:

-   -   1) contacting an adhesive with a surface of a first substrate;    -   2) contacting the adhesive with a surface of a second substrate;    -   3) applying ultrasonic energy to the adhesive to assist the        adhesive in bonding to the surface of the first substrate, the        surface of the second substrate or both.

The method has been found to be particularly desirable for assisting inproviding adhesive bonding in multiple different circumstances. As oneexample, the method can be employed for assisting in providing adhesivebonding in relatively short periods of time. As an additional oralternative example, the method can assist in providing a greater degreeof adhesive bonding in situations where that degree of bonding might nototherwise be achieved until a later point in time or at all.

It is contemplated that multiple different ultrasonic energy providersmay be used to provide ultrasonic energy to the adhesive. A typicalultrasonic energy provider will be configured to provide ultrasonicvibration and will include two or more of an energy source (e.g., apower supply or power generator), one or more energy processors (e.g., aconverter, a booster or both) and an energy transmitter (e.g., a horn).Generally, the energy source will provide energy that is processed, ifneeded, by the one or more energy processors and that energy is providedto and transmitted from the transmitter to an adhesive as is furtherdescribed below. Processing of the energy can include converting theenergy to a desired form for transmission (e.g., from electrical energyto ultrasonic energy such as ultrasonic vibrations), increasing ordecreasing the energy to the transmitter, changing the nature of theenergy to the transmitter or the like.

With reference to FIG. 1, there is illustrated an exemplary ultrasonicenergy provider 10. As shown, the provider 10 includes an energy orpower source 12, a first energy processor 14 shown as a converter, asecond energy processor 16 shown as a booster, and a transmitter 18shown as a horn. In the particular embodiment illustrated, the energysource 12 provides electrical energy (e.g., a voltage) to the firstenergy processor 14, which uses at least one, but preferably multiplepiezoelectric elements to convert the electrical energy to mechanicalenergy in the form of ultrasonic vibrations. The energy (e.g.,vibrations) is then provided to the second energy processor 16, whichincreases or decreases the amplitude of the vibrations therebyincreasing or decreasing the amount of energy transmitted to thetransmitter 18 in the form of ultrasonic vibrations. The transmitter 18then provides the ultrasonic energy (e.g., vibrations) to the adhesiveas is described further below.

One exemplary ultrasonic energy providers suitable for use in thepresent invention is a 2000 Series High Power provider commerciallyavailable from Branson Ultrasonics corporation, 41 Eagle Rd., DanburyConn., 06813. The providers can typically provided vibrations orultrasonic energy at a frequency of between about 10 KHz to about 50KHz, although high or lower frequencies may used unless otherwisespecified. Exemplary frequencies include, without limitation, 10 KHz, 20KHz and 40 KHz. It is also contemplated that different levels ofultrasonic energy could be applied progressively to an adhesive toachieve desired curing results.

Multiple different adhesives may be employed in the present invention,although particular adhesives are preferred. It is generally preferablethat the adhesive is compatible with (i.e., capable of adhering to) thematerial of the surface[s] of the substrate[s] (e.g., members,structures or the like) to which the adhesive is contacted. If, however,the adhesive is slightly or more substantially incompatible with one ofthese materials, it may be desirable to treat the surface[s] formed ofthe incompatible material. Exemplary treatments include the applicationof primer, exposure to plasma, combinations thereof or the like. Theadhesive used can be thermosettable, polymerizable or both and can be atwo component adhesive, a cure on demand adhesive (e.g., a latentadhesive) or otherwise.

The adhesive can be a urethane based adhesive, and more preferably aurethane adhesive. Alternatively, the adhesive may include a functionalcomponent selected from acrylonitrile butadiene styrene (ABS),polycarbonate (PC), or a mixture thereof (e.g. PC-ABS). The adhesive canadditionally or alternatively be a silane adhesive, a silicone adhesiveor a mixture thereof. An acrylic adhesive may be additionally oralternatively be employed. The adhesive may also include an epoxy or beepoxy based. It may include polyolefinics, styrenics, acrylics ormixtures thereof. In one embodiment, a preferred adhesive includes alkylborane. Examples of suitable adhesives are disclosed in commonly ownedU.S. patent Ser. No. 09/466,321 (filed Dec. 17, 1999) and patentpublication numbers 20020058764 and 20030001410 expressly incorporatedherein by reference for all purposes. Any such adhesive may includesuitable performance modifiers including art disclosed tackifiers,elastomers, impact modifiers, or the like. Potentially suitableadhesives are also disclosed in U.S. Pat. Nos. 6,709,539; 6,613,816;6,127,032; 5,194,550, all of which are incorporated herein by referencefor all purposes.

In one embodiment, a two part, organoborane/amine complex adhesive orother adhesive is employed for adhesively securing the structurestogether. Advantageously, such an adhesive can adhere to low surfaceenergy surfaces or substrates. As such, the adhesive is preferablycapable of bonding to corresponding surfaces having a surface energy ofless than 45 mJ/m².

Adhesives, polymerizable compositions and method of use disclosed inInternational Patent Application No. PCT/US00/33806, incorporated hereinby reference, are especially preferred for use in the present inventionto bond the structures.

In general, the adhesive should exhibit bonding that is at least partlydue to transmission of ultrasonic energy (e.g., vibrations) to theadhesive. Thus, the adhesive will exhibit an initial amount of bonding,an elevated or enhanced degree of bonding, substantially completebonding, a combination thereof or the like upon exposure to and due tothe ultrasonic energy. Such bonding is preferably relative to the amountof bonding the same adhesive would exhibit without exposure to theultrasonic energy.

Cure on demand adhesives such as thermosettable and/or latent adhesivesare particularly desirable adhesives that exhibit bonding upon exposureto ultrasonic energy. Latent adhesives typically exhibit bondingcharacteristics upon curing and/or thermosetting. As used herein, alatent adhesive is generally an adhesive that undergoes substantially nocuring and/or thermosetting (i.e., less that 5% curing and/orthermosetting) below a first temperature but undergoes substantiallyfull curing and/or thermosetting (i.e., greater than 70%, 80%, 90% ormore curing and/or thermosetting) above a second temperature, the secondtemperature being higher than the first temperature. The firsttemperature is typically less than about 80° C., more typically lessthan about 55° C. and even more typically less than about 30° C.,although higher or lower temperature may be possible. The secondtemperature is typically about greater than about 65° C., more typicallygreater than about 100° C. and even more possibly greater than about180° C., although higher or lower temperature may be possible. Latentcure adhesive often use energy to initiate or trigger a polymerizationreaction, a cross-linking reaction, a combination thereof or the likefor developing adhesive bond strength. Such latent adhesives can beepoxy type adhesives (e.g., epoxy polymers or material that are latentcured or thermoset by an amine). Such latent adhesives can also bepolyurethane or polyurea type adhesives (e.g., isocyanate reactivecompounds such as polyols that are latent cured or thermoset by anisocyanate). Other additional or alternative adhesive can include or bebased upon polyester, vinyl ester, phenolics, combinations thereof orthe like. Other potential adhesives are of the type that include a heatcurable silyl terminated polymer.

Two component adhesives can also be used according to the presentinvention. As used herein, a two component adhesive is an adhesive thatreacts to cure and/or thermoset upon mixing of a first or polymercomponent with a second or curative component and typicallysubstantially reacts (experiences at least 80%, 90% or more curing orthermosetting) at a temperature of about 23° C. As examples, the firstcomponent could include an epoxy polymer with the second componentincluding an amine. As another example, the first component couldinclude an isocyanate reactive compound and the second component includean isocyanate.

Whether latent, two component or otherwise, the adhesive can be acure-on-demand adhesive which requires a separate operation to cause theadhesive to begin to cure. In one embodiment this is achieved by usingan encapsulated curing agent which is ruptured during assembly orthrough exposure to heat. In another embodiment this is achieved byremoving a protective coating to expose the adhesive to ambientconditions. Curing can also be initiated by exposing the adhesive toheat, infrared or ultraviolet light sources, or to shearing forces andthe like.

While other adhesive families are contemplated as well (e.g., urethanes,acrylics, silanes, or the like), preferably the adhesive is a hightemperature epoxy resin, a polyimide, a hybrid polyimide/epoxy resinadhesive or an epoxy novolac/nitrile rubber adhesive. Preferredadhesives are the high temperature epoxy resin adhesives. Hightemperature epoxy resin adhesive means an adhesive wherein the primarycomponent is an epoxy resin which when cured can withstand exposure tothe temperatures mentioned above without decomposing or delaminatingfrom the substrate.

The adhesive is typically contacted with a surface of at least onesubstrate and, more typically is contacted with a surface of a firstsubstrate and a surface of a second substrate and ultrasonic energy isprovided to the adhesive thereby assisting in bonding the adhesive tothe surface[s]. The ultrasonic energy may be transmitted directly to theadhesive, but is more typically transmitted from the at least onesubstrate to the adhesive. In such an embodiment, an ultrasonic energyprovider and, more typically, a transmitter of the ultrasonic energyprovider is contacted with the substrate to transmit the ultrasonicenergy to the substrate, which, in turn, transmits the ultrasonic energyto the adhesive to assist the adhesive in bonding to the substrate[s].

With reference to FIG. 2, an adhesive 26 according to the presentinvention is contacted with a surface 28 of a first substrate 30 and asurface 32 of a second substrate 34. Before, after or at the same timeof such contacting, the ultrasonic provider 10 of FIG. 1, andparticularly the transmitter 18 of the provider is contacted with thefirst substrate 30 and transmits ultrasonic vibrations to the substrate30 and the substrate 30 transmits the ultrasonic vibrations to theadhesive 26 thereby assisting in bonding the adhesive 26 to the surfaces28, 32.

The surfaces to be bonded can be flat or planar as shown in FIG. 2. Thesurfaces may also be contoured as well. For example, any suitablecoacting surfaces for defining a joint may be employed, such as afriction fit, an interference fit or some other interlock fit, may beused. Examples of suitable joints include butt joints, lap joints,tongue in groove joints, scarf joints, combinations thereof, or thelike.

The ultrasonic energy can assist bonding according to one or moremechanisms. Generally, it is believed, without unnecessarily being boundby any particular theory, that the ultrasonic energy can assist theadhesive in wetting the surface of any substrate to which the adhesivehas been contacted. For illustrative purposes, reference is made toFIGS. 3A and 3B. FIG. 3A shows a magnified surface 40 after contactingof the surface 40 with an adhesive 42 but prior to application ofultrasonic energy and FIG. 3B shows the surface 40 after application ofthe ultrasonic energy. As can be seen, the ultrasonic energy andparticularly ultrasonic vibrations can assist the adhesive 42 incontacting a greater amount of the surface area of the surface 40thereby enhancing bonding to the surface 40. Such greater contacting canbe the result of movement of the surface and/or adhesive caused by theultrasonic energy and/or heating of the adhesive by the ultrasonicenergy which can make the adhesive more flowable. This type of bondingenhancement can be employed for a wide variety of adhesives as disclosedherein or otherwise and is particularly effective for liquid and orsemi-solid adhesives, although it may be used for initially solidadhesive as well.

Heating of the adhesive by ultrasonic energy (e.g., vibrations) can alsoassist the adhesive in bonding to surfaces of substrates in otherinstances as well. In particular, such heating can help with mechanismssuch as curing, thermosetting, cross-linking and/or polymerization ofadhesives and is therefore particularly helpful in assisting adhesives,which tend to bond through these mechanisms. It will be understood thatadhesives that bond according to each of these mechanisms have beendisclosed herein. Advantageously, in some embodiments of the presentinvention, ultrasonic energy can be used to partially or fully cure anadhesive while the temperature of the environment surrounding theadhesive (i.e., the temperature of air 1 cm away from the adhesive) canremain below 80° C., more typically below 50° C. and even more typicallybelow 35° C. In such embodiments, the adhesive can be heated for suchcure by ultrasonic energy without the use of added heat to theenvironment surrounding the adhesive such as by an oven.

Such adhesive heating through ultrasonic energy has been foundparticularly effective for cure on demand adhesives and even moreparticularly for latent curing adhesives disclosed herein. It will beunderstood that such heating can be used for any of the cure on demandadhesives or latent curing adhesives disclosed herein or otherwiseknown.

As one example of a cure on demand or latent curing system, the adhesivecan be composed of a base or polymeric material (e.g., an epoxy materialor isocyanate reactive material) that has catalyst, curing agent orother reactive compound contained within encapsulations (e.g.,thermoplastic shells), which are dispersed throughout the base orpolymeric material. Upon exposure to ultrasonic energy, theencapsulations typically fail (e.g., melt or rupture) to allow thereactive compound in the encapsulation to react with the base orpolymeric material thereby curing, polymerizing, cross-linking,thermosetting or a combination thereof the base or polymeric material.Such adhesives can typically be at least partially cured or moresubstantially cured by elevating the temperature of the adhesive tobetween about 40° C. and about 140° C., more typically between about 50°C. and about 100° C. and more typically between about 60° C. and about80° C. using ultrasonic energy alone or in conjunction with other heatalthough other temperatures may be used as well depending upon theencapsulation used. Other examples of these adhesives include polyolprepolymer with encapsulated isocyanate adhesive sold under thetradename BETAFORCE and commercially available from The Dow ChemicalCompany, Midland, Mich. Such adhesives can typically be at leastpartially cured or more substantially cured by elevating the temperatureof the adhesive to between about 50° C. and about 200° C., moretypically between about 80° C. and about 160° C. and more typicallybetween about 120° C. and about 140° C. using ultrasonic energy alone orin conjunction with other heat.

As one example of a cure on demand or latent curing system, the adhesivecan be composed of a base or polymeric material (e.g., an epoxy resin ormaterial or isocyanate reactive material) that has catalyst, curingagent or other reactive compound that cures, polymerizes, cross-links,thermosets or a combination thereof the base material when the adhesivereaches an elevated temperature. Examples of these adhesives include theBETAMATE series of adhesives, commercially available from The DowChemical Company, Midland, Mich. Such adhesives can typically be atleast partially cured or more substantially cured by elevating thetemperature of the adhesive to between about 120° C. and about 300° C.,more typically between about 150° C. and about 250° C. and moretypically between about 190° C. and about 210° C. using ultrasonicenergy alone or in conjunction with other heat.

Advantageously, the application of ultrasonic energy to the adhesivecan, depending upon the adhesive employed, result in relatively shortcure times for the adhesive. In particular, it has been found that anadhesive, or at least a portion of the adhesive, such as a latent curedadhesive can experience a substantial amount of cure (e.g., at least 30%cure, at least 60% cure, at least 90% cure or more) in a relativelyshort period time (e.g., less than 10 minutes, less than 2 minutes, lessthan 1 minute or below). Moreover, when an adhesive experience asubstantial amount of cure is such a time period, it can often exhibittensile strengths of at least about 250 psi, more typically at leastabout 300 psi, and possibly at least about 800 psi or at least about1000 psi when such strengths are measure according to SAE 1529.

It is noted that it can be advantageous to apply the ultrasonic energyintermittently and/or repeatedly, for example, by applying the energyfor a period of time followed by stopping the application of energyrepeatedly. In this manner, it may be possible to provide greater heatto the adhesive while providing less heat to the substrates whencompared with a continuous application of ultrasonic energy. It is alsocontemplated that the present invention can be used to spot cure or spotbond adhesives at one or multiple locations that are part of an overalladhesive bond or strip of adhesive for providing enough adhesion for aninitial bonding until the entirety of the adhesive later more fullycures and bonds.

The adhesion techniques of the present invention can be employed toassist in bonding an adhesive to a variety of different surface ofsubstrates, which can be formed of a variety of materials. For examples,the substrates and/or the surfaces or the substrates to be bonded can beformed of glass, metal (e.g., steel, aluminum or both), polymericmaterials (e.g., plastic, elastomers, thermoplastics, thermosets,combinations thereof or the like), fibrous materials (e.g., woods,fabrics or the like). Moreover, the techniques can be used to bond anadhesive to similar surfaces (i.e., surfaces made of similar or samematerials) or dissimilar surfaces (i.e., surfaces made of dissimilarmaterials). Thus, the techniques can be used to bond an adhesive to asurface of polymeric material to another surface of polymeric material,a surface of metal to another surface of metal, a surface of glass toanother surface of glass or the like. Alternatively, the techniques canbe used to bond an adhesive to a surface of polymeric material and asurface of glass, a surface of glass and a surface of metal, a surfaceof polymeric material to a surface of metal or the like. In eachinstance, it is generally preferable that the adhesive be formed of adifferent material than the one, two or more surfaces to which theadhesive is bonding.

It is additionally contemplated that the surfaces to which the adhesiveis being bonded can be coated surfaces. Examples include metal, glass orpolymeric surface coated by primer, paint, electro-coat, combinationsthereof or other coatings. Thus, as used herein, bonding a surfaceformed of first material to a surface formed of the same or differentmaterial includes bonding directly to that surface or bonding to thatsurface as coated, unless otherwise stated.

As suggested, surfaces of polymeric materials can include a thermosetmaterial, a thermoplastic material, or a mixture thereof. Amongpreferred high-performance thermoplastic materials are polybutyleneterephthalate, polyetherimides, polyphenylene ether/polyamide resins,polyether sulfone resins, polyether ether ketone resins, liquid crystalpolymers, polyarylsulfone resins, polyamideimide resins, polyphthalimideresins, nylon 6,6, polyamide resins, syndiotactic polystyrene, andblends thereof. In a particular preferred embodiment, the material is athermoplastic selected from polyamides, polystyrenes, polyolefins,polycarbonates, or mixtures thereof. More preferably, the material isselected from polyamides (e.g., nylon 6,6), polystyrenes or mixturesthereof. In one preferred embodiment, the material is a blend ofpolyamides and syndiotactic polystyrenes, and more preferably a blend ofnylon 6,6 and syndiotactic polystyrene. Among useful thermoset materialsare polyurethanes, epoxy resins, molding compounds (e.g., bulk and sheetmolding compounds) or the like.

Generally, it is contemplated that the ultrasonic energy provider can belocated at or adjacent a location where an adhesive is being applied to(i.e., contacted with) one or more surfaces and that the energy providercan provide energy to the adhesive in a relatively short period of timeafter the adhesive has been contacted with the one or more surfaces. Asused herein, a relatively short period of time as it refers toapplication of ultrasonic energy after application of adhesive istypically less than 10 hours, more typically less than 1.5 hours, evenmore typically less than 25 minutes and even possibly less than 10 oreven 5 minutes. As used herein, the term at or adjacent as it applies toa location of adhesive application typically means within 1000 meters,more typically within 300 meters, more typically within 100 meters,still more typically within 40 meters, and even possible within 15 oreven 8 meters. As an example, for automotive applications as discussedherein or otherwise, an ultrasonic energy provider can be providedwithin an automobile or automotive parts assembly plant and can belocated at or adjacent a location such as an automotive assembly linewhere an adhesive is being applied.

An adhesive can be substantially entirely or entirely cured and/orbonded through application of ultrasonic energy according to the presentinvention. It is also contemplated, however, that ultrasonic energy maybe employed to provide an initial or first degree of cure and/or bondingduring a first period of time and the adhesive can be configured toundergo a second degree of cure and/or bonding during a second period oftime that is distinct from the first period of time and is typically bya mechanism such as time or external heating that is different than theapplication of ultrasonic energy. In such circumstance, the first degreeof curing and/or bonding typically results in less than 90%, moretypically less than 70% and even possibly less than 40% of the overallcuring and/or bonding experienced through the first degree and seconddegree of bonding as measured by the amounts of the portions of theoverall adhesive that is cured and/or bonded or as measured by theamount of curing and/or bonding experienced throughout the entireadhesive. In such an embodiment, the tensile strength of the adhesiveexhibited after the first degree of curing and/or bonding will typicallybe at least 10% less, more typically at least 30% less and even moretypically at least 50% less than the tensile strength exhibited by theadhesive after the second degree of bonding and/or curing, although suchis not required unless otherwise specifically stated. Such tensilestrength can be measure according to SAE 1529.

Substrates and surfaces of those substrates that can be adheredaccording to the present invention can be part of members or structuresof furniture, transportation vehicles, household appliances, toys,electronic devices or other articles of manufacture. The presentinvention has been found particularly useful for automotive vehicles andmembers or structures of those vehicle which can include substrates andsurfaces suitable for adhesion include, without limitation, bodymembers, components of bumpers, components of a vehicle frame, componentof a vehicle roof, components (e.g., panels) of vehicle bodies,windshields, backlites, interior components, instrument panelassemblies, seat back assemblies, lamp assemblies, water conductorassemblies, radiator end tank assemblies, glove boxy assemblies, centerconsole assemblies, oil pan assemblies, engine intake manifoldassemblies, air bag door assemblies, pillars (e.g., metal flanges ofpillars), combinations thereof or the like. The present invention hasalso been found particularly useful in adhering a wire and harnessbracket to a frame (e.g., a metal frame that is preferably steel), whichmay be for an automotive vehicle or other article of manufacture.Moreover, these structures and members may be adhered to each otheraccording to the present invention, for example, frame components,pillar components, body components, roof components, combinationsthereof or the like can be adhered and/or bonded to other framecomponents, body components, pillar components, combinations thereof orthe like in attaching a roof module to the rest of a vehicle or inattaching other portions of vehicle together. Examples of these variousstructures, components and assemblies as well as adhesives being used inthem are disclosed in U.S. Pat. Nos. 7,137,670; 7,128,373; 6,997,515;6,988,757; 6,984,287; 6,860,010; 6,739,673; 6,739,302; 6,688,700;6,613,389; 6,543,404; 6,491,346; and U.S. Patent Publication Nos:20050082896; 20050040690; 20050005890; 20040238114; 20040231628;20040194877; 20040160089; 20040155513; 20040041429; 20030214082;20030159264; and 20030075968, all of which are hereby expresslyincorporated by reference for all purposes and for specificallydisclosing substrates and members that can be adhered to each otherusing the methodology and/or techniques of the present invention.

EXAMPLES

As one example and referring to FIG. 4, ultrasonic energy can be usedfor assisting in adhering a glass panel 50 (e.g., a windshield orbacklite) to one or more components 52, 54, 56, 58, of a vehicle such aspillars 52, 54, cowl or rear frame 56, roof 58 or others. In such anembodiment, an adhesive 62 is contacted with a surface (e.g., glasssurface) of the glass panel 50 and a surface (e.g., metal surface) ofone or more of the components 52, 54, 56, 58 and a transmitter of anultrasonic provider is contacted with the glass panel 50 or one or moreof the components 52, 54, 56, 58 to supply ultrasonic energy (e.g.,vibration) to the adhesive to assist the adhesive in bonding to thepanel 50 and/or the components 52, 54, 56, 58 according the invention asdescribed above. According to this example, an adhesive such apolyurethane or other adhesive can be relatively quickly bonded to afirst degree which is sufficient to allow further processing ormanufacture of the vehicle and then a second degree of adhesion can bereached in a period of time thereafter by virtue of the adhesive curingdue to exposure to moisture in the air or otherwise.

As another example, the bonding technique of the present invention canalleviate the need for temporary mechanical fasteners where suchfasteners are typically used to at least temporarily hold structurestogether as an adhesive cures and/or bonds to surfaces of substrates ofthe structures. Thus, an adhesive (e.g., an epoxy structural adhesive)can be contacted with a surface of a first substrate that is part of afirst structure of an article of manufacture (e.g., an automotivevehicle) and contacted with a surface of a second substrate that is partof a second structure of the article of manufacture and ultrasonicenergy can be applied as described above to bond the adhesive to thesurfaces in a relatively short period of time such that temporaryfasteners are unneeded. This can be particularly useful for providingbonding when one or more of the surfaces or substrates are plastic. Suchbonding can be provided in a first degree through ultrasonic energy andbonding to a second degree can be through another mechanism.Alternatively, curing by ultrasound energy can be substantially totalcuring.

As another example, the bonding technique of the present invention canalleviate the need for temporary fastening or attachment in instanceswhere an adhesive (e.g., an epoxy structural adhesive) is designed tocure in an automotive e-coat or paint bake oven. Thus, the adhesive canbe contacted with a surface of a first substrate that is part of a firststructure of an automotive vehicle and contacted with a surface of asecond substrate that is part of a second structure of the article ofmanufacture and ultrasonic energy can be applied as described above tobond the adhesive to the surfaces in a relatively short period of timesuch that temporary attachment or fastening is unneeded. This canprovide a first degree of curing and/or bonding and a second degree ofcuring and or bonding can be achieved in the e-coat or paint oven.Alternatively, curing by ultrasound energy can be substantially totalcuring.

Unless stated otherwise, dimensions and geometries of the variousstructures depicted herein are not intended to be restrictive of theinvention, and other dimensions or geometries are possible. Pluralstructural components can be provided by a single integrated structure.Alternatively, a single integrated structure might be divided intoseparate plural components. In addition, while a feature of the presentinvention may have been described in the context of only one of theillustrated embodiments, such feature may be combined with one or moreother features of other embodiments, for any given application. It willalso be appreciated from the above that the fabrication of the uniquestructures herein and the operation thereof also constitute methods inaccordance with the present invention.

The preferred embodiment of the present invention has been disclosed. Aperson of ordinary skill in the art would realize however, that certainmodifications would come within the teachings of this invention.Therefore, the following claims should be studied to determine the truescope and content of the invention.

1. A method of bonding an adhesive to a surface of an article ofmanufacture during formation of the article, the method comprising:contacting, during the formation of the article of manufacture, anadhesive with a surface of a first substrate, wherein: i. the adhesiveis a latent adhesive and includes a plurality of encapsulations whichare dispersed throughout the adhesive, wherein the plurality ofencapsulations encapsulate a curing agent or other reactive compound;ii. the adhesive includes at least one of an epoxy, a polyurethane, apolyurea, a polyester, a vinyl ester, or a silyl terminated polymer typeadhesive, or a phenolic; and iii. the article of manufacture isfurniture, a transportation vehicle, a household appliance, a toy or anelectronic device; and applying ultrasonic energy at a frequency ofabout 10 to about 50 KHz to the first substrate to assist in rupturingthe plurality of the encapsulations, thus releasing the curing agent orother reactive compound and bonding the adhesive to the surface of thefirst substrate without the use of added heat to an environmentsurrounding the adhesive, wherein the ultrasonic energy is used toprovide a first degree of bonding and the adhesive undergoes a seconddegree of bonding at a later time.
 2. A method as in claim 1 furthercomprising contacting the adhesive with a surface of a second substratewherein the application of ultrasonic energy to the adhesive assists inbonding the adhesive to the surface of the second substrate.
 3. A methodas in claim 2 wherein the first substrate is part of a structure of anautomotive vehicle and the second structure is part of an automotivevehicle.
 4. A method as in claim 1 wherein the adhesive is a heat and/orlatent curable adhesive that is selected from an epoxy type adhesive, apolyurethane type adhesive, a polyurea type adhesive or a silylterminated polymer type adhesive.
 5. A method as in claim 1 wherein theultrasonic energy is provided as ultrasonic vibrations.
 6. A method asin claim 1 wherein the surface of the first substrate and the surface ofthe second substrate are contoured.
 7. A method of bonding an adhesiveto a surface of an article of manufacture during formation of thearticle, the method comprising: contacting, during the formation of thearticle of manufacture, an adhesive with a surface of a first substrate,wherein: iv. the adhesive is a latent adhesive and includes a pluralityof encapsulations which are dispersed throughout the adhesive, whereinthe plurality of encapsulations encapsulate a curing agent or otherreactive compound; v. the adhesive includes at least one of an epoxy, apolyurethane, a polyurea, a polyester, a vinyl ester or a phenolic; andvi. the article of manufacture is furniture, a transportation vehicle, ahousehold appliance, a toy or an electronic device; and applyingultrasonic energy at a frequency of about 10 to about 50 KHz to thefirst substrate to assist in rupturing the plurality of theencapsulations, thus releasing the curing agent or other reactivecompound and bonding the adhesive to the surface of the first substratewithout the use of added heat to an environment surrounding theadhesive; wherein the ultrasonic energy is applied intermittently andrepetitively.
 8. A method as in claim 1 wherein the ultrasonic energy isemployed to cure only one or more portions of the adhesive.
 9. A methodas in claim 1 further comprising: contacting, also during the formationof the article of manufacture, the adhesive with a surface of a secondsubstrate wherein the article of manufacture is an automotive vehicleand the first substrate or the second substrate are members of theautomotive vehicle.
 10. A method as in claim 9 wherein the adhesive isselected from an epoxy type adhesive, a polyurethane type adhesive, apolyurea type adhesive or a silyl terminated polymer type adhesive. 11.A method as in claim 9 wherein the ultrasonic energy is provided asultrasonic vibrations.
 12. A method as in claim 9 wherein the surface ofthe first substrate and the surface of the second substrate arecontoured.
 13. A method as in claim 9 wherein the ultrasonic energy isused to provide a first degree of bonding and the adhesive undergoes asecond degree of bonding at a later time.
 14. A method as in claim 9wherein the ultrasonic energy is applied intermittently andrepetitively.
 15. A method as in claim 9 wherein the ultrasonic energyis employed to cure only one or more portions of the adhesive.
 16. Amethod of bonding an adhesive to a surface of an article of manufactureduring formation of the article, the method comprising: contacting,during the formation of the article of manufacture, an adhesive with asurface of a first substrate, wherein: vii. the adhesive is a latentadhesive and includes a plurality of encapsulations which are dispersedthroughout the adhesive, wherein the plurality of encapsulationsencapsulate a curing agent or other reactive compound; viii. theadhesive includes at least one of an epoxy, a polyurethane, a polyurea,a polyester, a vinyl ester or a phenolic; and ix. the article ofmanufacture is furniture, a transportation vehicle, a householdappliance, a toy or an electronic device; and applying ultrasonic energyat a frequency of about 10 to about 50 KHz to the first substrate toassist in rupturing the plurality of the encapsulations, thus releasingthe curing agent or other reactive compound and bonding the adhesive tothe surface of the first substrate without the use of added heat to anenvironment surrounding the adhesive; wherein different levels ofultrasonic energy are applied progressively.
 17. A method according toclaim 1 wherein the ultrasonic energy is applied when the article ofmanufacture is in an environment of below 35° C.
 18. A method accordingto claim 9 wherein different levels of ultrasonic energy are appliedprogressively.